Silicon Semiconductor

Synopsys introduces first wave of Multiphysics Fusion solutions

Multiphysics Fusion™ solutions for customer deployment. As chip complexity increases, physics-related challenges including ...
IEEE

Theoretical Study of Self-Heating-Induced Thermal Stress Effects on Quantum Transport in p-Type Ultrathin Body-FinFET by Multiphysics Simulation

Abstract: Self-heating of the device will intensify the thermo-mechanical effects, leading to an increase in thermal stress. Currently, most of the research focuses on strain engineering of the device ...
Aerospace and Mechanical Insider on MSN

AI-driven simulation platforms advance multiphysics engineering

The latest wave of simulation technology releases from Ansys, Cadence, and Avnet underscores a growing convergence of ...
IEEE

The Design and Simulation of Spiral Planar Coil in COMSOL Multiphysics

Abstract: The aim of this paper is to calculate the inductance of a spiral planar coil. COMSOL Multiphysics software was used to calculate the inductance. The article describes the design of the ...